Numerical prediction of electronic component heat transfer: An industry perspective

被引：11

作者：

Eveloy, V ^{[1
]}

Rodgers, P ^{[1
]}

Hashmi, MSJ ^{[1
]}

机构：

[1] Elect Thermal Management Ltd, Westport, Mayo, Ireland

来源：

NINETEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM | 2003年

关键词：

CFD; component; PCB; modeling; prediction; benchmark; reliability; virtual prototyping; electronics cooling;

D O I：

10.1109/STHERM.2003.1194334

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

This study aims to provide a perspective on the current capabilities of Computational Fluids Dynamics (CFD) as a design tool to predict component operating temperature in electronic systems. A systematic assessment of predictive accuracy is presented for Printed Circuit Board (PCB)mounted component heat transfer, using a CFD code dedicated to the thermal analysis of electronic systems. Component operating temperature predictive accuracy ranges from +3degreesC to +22degreesC (up to 35%) of measurement, depending on component location on the board, airflow velocity and flow model applied. Combined with previous studies, the results highlight that component junction temperature needs to be experimentally measured when used for strategic product design decisions and reliability predictions. Potential development areas are discussed for improved analysis.

引用

页码：14 / 26

页数：13

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