Dependence of Electric Strength on the Ambient Temperature

At present, the volume concentration of electronic components in their miniaturization to different types of microchips and increasing their performance raises the problem of cooling such elements due to the increasing density of heat flow of heat loss. Compliance with safe operating temperature of active semiconductor element is very closely related to the reliability and durability not only components, but also the entire device. Often it is also necessary to electrically isolate the unit from the side of the cooler air. Cooling demand by natural convection is typical for applications with high operating reliability. To the reliability of the system for removing heat loss increased, it is necessary to minimize need to use the mechanically or electrically powered elements, such as circulation pumps or fans. Experience to date with applications of heat pipe in specific systems appears to be the most appropriate method of cooling.