Material Removal Mechanism of Single Crystal γ-TiAl Alloy by Double Abrasive Micro Cutting

被引：0

作者：

Li Junye ^{[1
]}

Xie Hongcai ^{[1
]}

Zhang Xinming ^{[1
]}

Zhao Weihong ^{[1
]}

Shi Guangfeng ^{[1
]}

Xu Chengyu ^{[1
]}

机构：

[1] Changchun Univ Sci & Technol, Key Lab Cross Scale Micro & Nano Mfg, Minist Educ, Changchun 130022, Peoples R China

来源：

RARE METAL MATERIALS AND ENGINEERING | 2021年 / 50卷 / 02期

基金：

中国国家自然科学基金;

关键词：

single crystal gamma-TiAI alloy; material removal mechanism; molecular dynamics; FLOW; SIMULATION;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In order to analyze the material removal mechanism of single crystal gamma-TiAl alloy in grinding, the molecular dynamics model of Ti-Al alloy ground by two abrasive grains was established. The influence of lateral and longitudinal spacing of the diamond abrasive on the material removal mechanism of the single crystal gamma-TiAL alloy was revealed. The results show that the micro cutting process of single crystal gamma-TiAl alloy is accompanied by the change of temperature, potential energy, dislocation, as well as lattice phase transition. Cutting force, cutting temperature, potential energy and removal efficiency increase with the increase of lateral spacing, but are less affected by longitudinal spacing. The number of lattice phase transition atoms increases with the increase of lateral spacing and decreases with the increase of longitudinal spacing. With the increase of lateral and longitudinal spacing, the number of dislocations, total length of dislocations, and density of dislocations increase accordingly.

引用

页码：396 / 407

页数：12

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