A Single-Chip 8-Band CMOS Transceiver for 3G Cellular Systems with Digital Interface

被引:2
|
作者
Yoshida, Hiroshi [1 ]
Toyoda, Takehiko [1 ]
Tsurumi, Hiroshi [1 ]
Itoh, Nobuyuki [1 ]
机构
[1] Toshiba Co Ltd, Kawasaki, Kanagawa 2108520, Japan
关键词
W-CDMA; GSM; 3G; direct conversion; DC offset; AGC;
D O I
10.1587/transfun.E93.A.375
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
In this paper, a single-chip dual-mode 8-band 130 nm CMOS transceiver including A/D/A converters and digital filters with 312 MHz LVDS interface is presented. For a transmitter chain, linear direct quadrature modulation architecture is introduced for both W-CDMA/HSDPA (High Speed Uplink Packet Access) and for GSM/EDGE. Analog baseband LPFs and quadrature modulators are commonly used both for GSM and for EDGE. For a direct conversion receiver chain, AB B (Analog Base-Band) blocks, i.e., LPFs and VGAs, delta-sigma A/D converters, and FIR filters are commonly used for W-CDMA/HSDPA (High Speed Downlink Packet Access) and GSM/EDGE to reduce chip area. Their characteristics can be reconfigured by register-based control sequence. The receiver chain also includes high-speed DC offset cancellers both in analog and in digital stage, and the self-contained AGC controller, whose parameters such as time constant are programmable to be free from DBB (Digital Base-Band) control. The transceiver also includes wide-range VCOs and fractional PLLs, an LVDS driver and receiver for high-speed digital interface of 312 MHz. Measured results reveal that the transceiver satisfies 3GPP specifications for W-CDMA/HSPA (High Speed Packet Access) and GSM/EDGE.
引用
收藏
页码:375 / 381
页数:7
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