共 25 条
[1]
AGETHEN M, 2002, 14 IPRM, P673
[6]
Low-cost, multi-GHz electrical packaging for serial optoelectronic links utilizing vertical cavity surface emitting lasers
[J].
IEEE TRANSACTIONS ON ADVANCED PACKAGING,
2000, 23 (01)
:42-54
[8]
VCSEL electrical packaging analysis and design guidelines for multi-GHz applications
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING,
1997, 20 (03)
:191-201
[10]
IGA K, 2002, VERTICAL SURFACE EMI, P176