An Active Deep Learning Method for the Detection of Defects in Power Semiconductors

被引:5
作者
Bellini, Marco [1 ]
Pantalos, Georges [2 ]
Kaspar, Peter [1 ]
Knoll, Lars [1 ]
De-Michielis, Luca [1 ]
机构
[1] Hitachi ABB Power Grids, Semicond, Lenzburg, Switzerland
[2] ETH, Dept Mech Engn, Zurich, Switzerland
来源
2021 32ND ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC) | 2021年
关键词
Silicon defects; deep learning; active learning; convolutional neural network; SPATIAL-PATTERN; RECOGNITION;
D O I
10.1109/ASMC51741.2021.9435657
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Accurate detection of semiconductor defects is crucial to ensure reliability of operation and to improve yield by understanding and eradicating yield detractors. Recent advances in computer vision driven by Deep Convolutional Neural Networks (DCNN) and transfer learning have enabled novel techniques for defect detection and classification [1-7]. However, training neural networks requires very large datasets, even with transfer learning. This paper addresses this shortcoming by introducing for the first time the active learning approach for semiconductor devices. The proposed neural network can accurately identify defective dies with modest efforts in terms of annotating the image set. Finally, the feature maps of the DCNN are used to generate an unsupervised taxonomy of the semiconductor die defects, supporting further investigations to address yield detractors
引用
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页数:5
相关论文
共 10 条
  • [1] A neural-network approach to recognize defect spatial pattern in semiconductor fabrication
    Chen, FL
    Liu, SF
    [J]. IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2000, 13 (03) : 366 - 373
  • [2] Drozda-Freeman A, 2007, ASMC PROC, P234
  • [3] Recognition of defect spatial patterns in semiconductor fabrication
    Hsieh, HW
    Chen, FL
    [J]. INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH, 2004, 42 (19) : 4153 - 4172
  • [4] Speed/accuracy trade-offs for modern convolutional object detectors
    Huang, Jonathan
    Rathod, Vivek
    Sun, Chen
    Zhu, Menglong
    Korattikara, Anoop
    Fathi, Alireza
    Fischer, Ian
    Wojna, Zbigniew
    Song, Yang
    Guadarrama, Sergio
    Murphy, Kevin
    [J]. 30TH IEEE CONFERENCE ON COMPUTER VISION AND PATTERN RECOGNITION (CVPR 2017), 2017, : 3296 - +
  • [5] A CNN-Based Transfer Learning Method for Defect Classification in Semiconductor Manufacturing
    Imoto, Kazunori
    Nakai, Tomohiro
    Ike, Tsukasa
    Haruki, Kosuke
    Sato, Yoshiyuki
    [J]. IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2019, 32 (04) : 455 - 459
  • [6] Microsoft COCO: Common Objects in Context
    Lin, Tsung-Yi
    Maire, Michael
    Belongie, Serge
    Hays, James
    Perona, Pietro
    Ramanan, Deva
    Dollar, Piotr
    Zitnick, C. Lawrence
    [J]. COMPUTER VISION - ECCV 2014, PT V, 2014, 8693 : 740 - 755
  • [7] Faster R-CNN: Towards Real-Time Object Detection with Region Proposal Networks
    Ren, Shaoqing
    He, Kaiming
    Girshick, Ross
    Sun, Jian
    [J]. IEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHINE INTELLIGENCE, 2017, 39 (06) : 1137 - 1149
  • [8] Said AF, 2013, ASMC PROC, P130
  • [9] Defect detection on semiconductor wafer surfaces
    Shankar, NG
    Zhong, ZW
    [J]. MICROELECTRONIC ENGINEERING, 2005, 77 (3-4) : 337 - 346
  • [10] Matching Based Two-Timescale Resource Allocation for Cooperative D2D Communication
    Yuan, Yiling
    Yang, Tao
    Hu, Yulin
    Feng, Hui
    Hu, Bo
    [J]. 2019 11TH INTERNATIONAL CONFERENCE ON WIRELESS COMMUNICATIONS AND SIGNAL PROCESSING (WCSP), 2019,