共 50 条
- [1] 3-D Stacked Die: Now or Future? PROCEEDINGS OF THE 47TH DESIGN AUTOMATION CONFERENCE, 2010, : 298 - 299
- [2] 3-D design of stacked die and SiP Jensen, G. (gjensen@cad-design.com), 2005, IHS Publishing Group (14):
- [5] Advanced 3-D stacked technology PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, : 13 - 18
- [6] A Resilient 3-D Stacked Multicore Processor Fabricated Using Die-level 3-D Integration and Backside TSV Technologies 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 304 - 308
- [9] Reliability study of 3-D stacked structures 52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 1449 - 1453