Integrated circuit package band puss filter

The recent advances in such highly integrated RF transceivers as radio system-on-chip and radio system-in-package have called for the parallel development of compact filters. This paper addresses the development of a new type of dielectric chip filter known as integrated circuit package filter (ICPF) for highly integrated RF transceivers. A compact ICPF of this type has, for the first time, been designed in a ceramic ball grid array (CBGA) package format that measures only 15 x 15 x 2.0 mm. The novel ICPF, except economical advantage of mass production and automatic assembly, has potential benefit to the system-level board miniaturization and the system-level manufacturing facilitation. Results show that the ICPF achieved percentage bandwidth of 5.1% and insertion loss of 1.5 dB at 2.4 GHz. Details of design and analysis of the ICPF are presented and discussed.