Cooling thermal parameters, microstructural spacing and mechanical properties in a directionally solidified hypereutectic Al-Si alloy

被引：22

作者：

Reyes, Rodrigo V. ^{[1
]}

Kakitani, Rafael ^{[2
]}

Costa, Thiago A. ^{[2
]}

Spinelli, Jose E. ^{[1
]}

Cheung, Noe ^{[2
]}

Garcia, Amauri ^{[2
]}

机构：

[1] Fed Univ Sao Carlos UFSCar, Dept Mat Engn, Sao Carlos, SP, Brazil

[2] Univ Estadual Campinas, Dept Mfg & Mat Engn, UNICAMP, Campinas, SP, Brazil

来源：

PHILOSOPHICAL MAGAZINE LETTERS | 2016年 / 96卷 / 06期

基金：

巴西圣保罗研究基金会;

关键词：

Solidification; microstructure; cooling thermal parameters; mechanical properties; UNIDIRECTIONAL SOLIDIFICATION; DENDRITIC MICROSTRUCTURE; MATHEMATICAL-MODEL; GROWTH; SILICON; METALS; MOLDS;

D O I：

10.1080/09500839.2016.1192297

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Transient directional solidification experiments have been carried out with an Al-15wt. %Si alloy under cooling rates (http://www.w3.org/1999/xlink" xlink:href="tphl_a_1192297_ilm0001.gif") from 0.2 to 54K/s. A mixture of globular and fibre-like Si particles within the eutectic is shown to occur for cooling rates (http://www.w3.org/1999/xlink" xlink:href="tphl_a_1192297_ilm0002.gif")>9K/s. The presence of refined globular Si particles arranging the microstructure either as primary particles or within the eutectic mixture seems to contribute for a combination of high tensile strength (sigma(u)) and elongation (). It is shown by correlations between eutectic () and secondary dendrite ((2)) spacings and sigma(u) and , given by Hall-Petch type formulae that the tensile properties increase significantly with the decrease in these spacings. However, it is shown that for higher ranges of spacings, i.e.: (-1/2)<0.65 and (-1/2)(2)<0.18, both tensile strength and elongation remain unaltered.

引用

页码：228 / 237

页数：10

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