Analysis of Stress Intensity Factor for Interfacial Crack in Bonded Dissimilar Plate under Bending

被引：0

作者：

Kakuno, Hatsuki ^{[1
]}

Oda, Kazuhiro ^{[1
]}

Morisaki, Tetsuya ^{[1
]}

机构：

[1] Tokuyama Coll Technol, Yamaguchi 7458585, Japan

来源：

ADVANCES IN FRACTURE AND DAMAGE MECHANICS VIII | 2010年 / 417-418卷

关键词：

Stress Intensity Factor; Finite Element Method; Interface Crack; Bending Specimen;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper presents the simple method to determine the complex stress intensity factor of interface crack in hi-material plate under bending. In the present method, the stress values at the crack tip calculated by HEM are used and the stress intensity factors of interface crack are evaluated from the ratio of stress values between a given and a reference problems. A single interface crack in an infinite bi-material plate subjected to tension and shear is selected as the reference problem in this study. The accuracy of the present analysis is discussed through the results obtained by body force method. As the result, it is confirmed that the present method is useful for analyzing the interface crack under bending.

引用

页码：153 / 156

页数：4

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