共 3 条
Fabrication of vertical through-holes to realize high throughput cell counting
被引:2
作者:
Chen, Yu
[1
]
Chen, Ming-Yuan
[1
]
机构:
[1] ASTAR, Inst Microelect, 2 Fusionopolis Way,08-02 Innovis, Singapore 138634, Singapore
来源:
2020 IEEE 22ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC)
|
2020年
关键词:
D O I:
10.1109/EPTC50525.2020.9315101
中图分类号:
T [工业技术];
学科分类号:
08 ;
摘要:
It is desirable to have high throughput cells counting and sizing for various biomedical applications. We have previously reported a micro-machined multiple-channel Coulter counter device to realize such a requirement at a low cost. To further extend the throughput of the device, a 2-D array needs to be developed, and each microchannel (vertical through-hole) should have an independent fluidic pass. In this paper, we present the process flow to fabricate the vertical through-hole array chip. The whole fabrication process is CMOS (Complementary metal-oxide-semiconductor) compatible. The enhanced throughput and sensitivity have been demonstrated by measuring various sized cells in a buffer solution.
引用
收藏
页码:189 / 193
页数:5
相关论文