Solution Processed Metal Oxide High-κ Dielectrics for Emerging Transistors and Circuits

被引:181
作者
Liu, Ao [1 ]
Zhu, Huihui [1 ]
Sun, Huabin [1 ]
Xu, Yong [1 ]
Noh, Yong-Young [1 ]
机构
[1] Dongguk Univ, Dept Energy & Mat Engn, 30 Pildong Ro,1 Gil, Seoul 04620, South Korea
关键词
field-effect transistors; high-kappa dielectrics; metal oxide insulator; solution processing; thin-film transistors; THIN-FILM TRANSISTORS; LOW-TEMPERATURE FABRICATION; FIELD-EFFECT TRANSISTORS; SELF-ASSEMBLED MONOLAYERS; DOPED ZNO TRANSISTORS; HIGH-PERFORMANCE; LOW-VOLTAGE; GATE DIELECTRICS; HIGH-MOBILITY; COMBUSTION SYNTHESIS;
D O I
10.1002/adma.201706364
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
The electronic functionalities of metal oxides comprise conductors, semiconductors, and insulators. Metal oxides have attracted great interest for construction of large-area electronics, particularly thin-film transistors (TFTs), for their high optical transparency, excellent chemical and thermal stability, and mechanical tolerance. High-permittivity (kappa) oxide dielectrics are a key component for achieving low-voltage and high-performance TFTs. With the expanding integration of complementary metal oxide semiconductor transistors, the replacement of SiO2 with high-kappa oxide dielectrics has become urgently required, because their provided thicker layers suppress quantum mechanical tunneling. Toward low-cost devices, tremendous efforts have been devoted to vacuum-free, solution processable fabrication, such as spin coating, spray pyrolysis, and printing techniques. This review focuses on recent progress in solution processed high-kappa oxide dielectrics and their applications to emerging TFTs. First, the history, basics, theories, and leakage current mechanisms of high-kappa oxide dielectrics are presented, and the underlying mechanism for mobility enhancement over conventional SiO2 is outlined. Recent achievements of solution-processed high-kappa oxide materials and their applications in TFTs are summarized and traditional coating methods and emerging printing techniques are introduced. Finally, low temperature approaches, e.g., ecofriendly water-induced, self-combustion reaction, and energy-assisted post treatments, for the realization of flexible electronics and circuits are discussed.
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页数:39
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