Some Facts from Lead-free Solders Reliability Investigation

被引：0

作者：

Szendiuch, Ivan ^{[1
]}

Stary, Jiri ^{[1
]}

Sandera, Josef ^{[1
]}

Bursik, Martin ^{[1
]}

Hejatkova, Edita ^{[1
]}

机构：

[1] Brno Univ Technol, Fac Elect Engn & Commun, Dept Microelect, CZ-60200 Brno, Czech Republic

来源：

2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2 | 2009年

关键词：

lead-free solder; solders joint structure formation; wettability; solder joint reliability testing;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

There are done many research works following investigation of lead-free solders, and differently results are achieved for identical solder materials. The reason is simple, the some solder compound can show diverse results when other material and process parameters are different. That is reason why we have addicted on investigation of some critical areas which has significant impact on solder joint reliability and lifetime. At length the soldering area should be divided in three principal parts that are materials and components, process and equipments, and design and testing. Our actual research work at Brno University of Technology is focused on soldering process parameters impact on solder joint structure, on wetting angle changes in dependence on material/process parameters and on thermo mechanical strain of soldered joints

引用

页码：513 / 517

页数：5