Fatigue life of a microcantilever beam in bending

被引：8

作者：

Hocheng, H ^{[1
]}

Kao, KS ^{[1
]}

Fang, W ^{[1
]}

机构：

[1] Natl Tsing Hua Univ, Dept Power Mech Engn, Hsinchu 300, Taiwan

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2004年 / 22卷 / 06期

关键词：

D O I：

10.1116/1.1821502

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The fatigue behavior of a microcantilever beam loaded by various magnetic force's is investigated. The MEMS fabrication techniques, such as exposure, lithography, etching.. etc.. are applied to construct the micro structures on a silicon wafer. FEM and SEM are employed to study the relations between fractographies, stresses, and strains. The experimental results indicate that the deformation, stress and strain increase as the magnetic force increases. while the fatigue cycle time decreases with the load. The fatigue life lies in the range of 1-5 x 10(7) cycles at 12-15 MPa produced by the magnetic flux. Fracture occurs at the location of the maximum stress as predicted by an analytical approach. (C) 2004 American Vacuum Society.

引用

页码：3143 / 3146

页数：4

共 22 条

[1] Tensile-mode fatigue testing of silicon films as structural materials for MEMS [J].

Ando, T ;

Shikida, M ;

Sato, K .

SENSORS AND ACTUATORS A-PHYSICAL, 2001, 93 (01) :70-75

[2]

CHRISTOPHER, 2001, J MICROELECTROMECH S, V10, P593

[3]

GERE, 1997, MECH MAT

[4] Calibration of AFM cantilever spring constants [J].

Gibson, CT ;

Weeks, BL ;

Abell, C ;

Rayment, T ;

Myhra, S .

ULTRAMICROSCOPY, 2003, 97 (1-4) :113-118

[5] Microscale materials testing using MEMS actuators [J].

Haque, MA ;

Saif, MTA .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2001, 10 (01) :146-152

[6]

JONES PT, 1996, P MEMS DSC, V59, P325

[7]

Kovacs G.T., 1998, Micromachined Transducers Sourcebook

[8] Bulk micromachining of silicon [J].

Kovacs, GTA ;

Maluf, NI ;

Petersen, KE .

PROCEEDINGS OF THE IEEE, 1998, 86 (08) :1536-1551

[9] Fatigue in thin films: lifetime and damage formation [J].

Kraft, O ;

Schwaiger, R ;

Wellner, P .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2001, 319 :919-923

[10] MEMS device for bending test: measurements of fatigue and creep of electroplated nickel [J].

Larsen, KP ;

Rasmussen, AA ;

Ravnkilde, JT ;

Ginnerup, M ;

Hansen, O .

SENSORS AND ACTUATORS A-PHYSICAL, 2003, 103 (1-2) :156-164

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