共 17 条
[1]
Influence of ceramic surface treatment on peel-off strength between aluminum nitride and epoxy-modified polyaminobismaleimide adhesive
[J].
IEEE TRANSACTIONS ON ADVANCED PACKAGING,
2001, 24 (01)
:104-112
[2]
Berger C., 2002, Proceedings of the SPIE, P222
[3]
Characterization of parallel optical-interconnect waveguides integrated on a printed circuit board
[J].
MICRO-OPTICS, VCSELS, AND PHOTONIC INTERCONNECTS,
2004, 5453
:134-141
[5]
Realization of Electrical-Optical-Circuit-Board Self-packaging
[J].
57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS,
2007,
:1368-+
[7]
Cai D.K., 2007, P OPT FIB COMM OFC 2
[8]
CAI DK, MICROFLUID IN PRESS, DOI DOI 10.1007/S10404-010-0596-1
[9]
CAI DK, MICROELECTR IN PRESS, DOI DOI 10.1016/J.MEE.2010.02.014