Epitaxial growth and characterization of Cu thin films deposited on Al2O3(0001) substrates by magnetron sputtering

被引:3
作者
Lee, Ik-Jae [1 ]
Kim, Hee Seob [1 ]
Yun, Young Duck [1 ]
Kang, Seen-Woong [1 ]
Kim, Hyo-Yun [1 ]
Kwon, Hyuk Chae [1 ]
Kim, Jin Woo [2 ]
Joo, Mankil [3 ]
Kim, Younghak [1 ]
机构
[1] POSTECH, Pohang Accelerator Lab, Pohang 37673, South Korea
[2] Gwangju Inst Sci & Technol, Ctr Adv Xray Sci, Gwangju 61005, South Korea
[3] Res Inst Ind Sci & Technol, Seoul 37673, South Korea
基金
新加坡国家研究基金会;
关键词
Copper; Epitaxial growth; Magnetron sputter; X-ray diffraction; Electrical resistivity; Surface roughness; X-RAY-ABSORPTION; COPPER METALLIZATION; ELECTROMIGRATION; TEMPERATURE; RESISTIVITY; MICROSCOPY; SCATTERING; EVOLUTION; METAL;
D O I
10.1016/j.matlet.2021.130119
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Epitaxial Cu thin films were grown on Al2O3 (0001) substrate by radio frequency magnetron sputtering. The epitaxial relations were found to be Cu(111)//Al2O3(0001 Cu[1_0]//Al(0001 Cu[1_0]//Al2O3[1_100] in the out-of-plane direction and Cu(1_10)//Al2O3(11_20), Cu[111]//Al2O3[0001] in the in-plane direction. Oxygen adsorbed from the air does not affect the structure of Cu/Al2O3(0001) epitaxial thin films. The evolution of the surface roughness can be described by a dynamic scaling exponent. In these Cu/Al2O3(0001) epitaxial thin films, the electrical resistivity rho decreased as their thickness t(Cu) increased; the trend was described well using a second-order exponential function; this result suggests that rho changes rapidly when t(Cu) is thinner than the effective thickness t(eff), and changes gradually when t(Cu) > t(eff). (C) 2021 The Authors. Published by Elsevier B.V.
引用
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页数:6
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