Bonding strength of W-Cu joint by PECS method

被引：1

作者：

Fukuzawa, Yasushi ^{[1
]}

Nagasawa, Shigeru ^{[1
]}

Takaoka, Shigehiko ^{[2
]}

机构：

[1] Nagaoka Univ Technol, 1603-1 Kamiatomioka, Nagaoka, Niigata 9402188, Japan

[2] Allied Mat Co, Toyama 931 8543, Japan

来源：

DESIGNING OF INTERFACIAL STRUCTURES IN ADVANCED MATERIALS AND THEIR JOINTS | 2007年 / 127卷

关键词：

pulse electric current sintering; joining; bonding strength; interlayer;

D O I：

10.4028/www.scientific.net/SSP.127.271

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

To make the tungsten and copper joint, several methods has been tried using the diffusion bonding system. When the thin plating Ni layer was used as the interlayer on tungsten surface, it bonded with copper under low bonding temperature and short holding duration by the pulse electric current sintering (PECS) machine. The effects of bonding temperature, bonding duration time, bonding pressure and the difference of specimen shape on the bonding strength were investigated. The tensile strength of joints depended on these factors. Highest strength attained to the copper tensile strength.

引用

页码：271 / +

页数：2