Defect-engineered epitaxial VO2±δ in strain engineering of heterogeneous soft crystals

被引:48
作者
Wang, Yiping [1 ]
Sun, Xin [2 ]
Chen, Zhizhong [1 ]
Cai, Zhonghou [3 ]
Zhou, Hua [3 ]
Lu, Toh-Ming [2 ]
Shi, Jian [1 ]
机构
[1] Rensselaer Polytech Inst, Dept Mat Sci & Engn, Troy, NY 12180 USA
[2] Rensselaer Polytech Inst, Dept Phys Appl Phys & Astron, Troy, NY 12180 USA
[3] Argonne Natl Lab, Xray Sci Div, Lemont, IL 60439 USA
关键词
METAL-INSULATOR TRANSITIONS; PEROVSKITE SINGLE-CRYSTALS; THIN-FILMS; VANADIUM DIOXIDE; HALIDE PEROVSKITES; PHASE-TRANSITION; ELASTIC STRAIN; BAND-STRUCTURE; LAYER FESE; VO2;
D O I
10.1126/sciadv.aar3679
中图分类号
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号
07 ; 0710 ; 09 ;
摘要
The success of strain engineering has made a step further for the enhancement of material properties and the introduction of new physics, especially with the discovery of the critical roles of strain in the heterogeneous interface between two dissimilar materials (for example, FeSe/SrTiO3). On the other hand, the strain manipulation has been limited to chemical epitaxy and nanocomposites that, to a large extent, limit the possible material systems that can be explored. By defect engineering, we obtained, for the first time, dense three-dimensional strongly correlated VO2 +/-delta epitaxial nanoforest arrays that can be used as a novel "substrate" for dynamic strain engineering, due to its metal-insulator transition. The highly dense nanoforest is promising for the possible realization of bulk strain similar to the effect of nanocomposites. By growing single-crystalline halide perovskite CsPbBr3, a mechanically soft and emerging semiconducting material, onto the VO2 +/-delta a heterogeneous interface is created that can entail a similar to 1% strain transfer upon the metal-insulator transition of VO2 +/-delta. This strain is large enough to trigger a structural phase transition featured by PbX6 octahedral tilting along with a modification of the photoluminescence energy landscape in halide perovskite. Our findings suggest a promising strategy of dynamic strain engineering in a heterogeneous interface carrying soft and strain-sensitive semiconductors that can happen at a larger volumetric value surpassing the conventional critical thickness limit.
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页数:10
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