Improved Finite Element Modeling of Moisture Diffusion Considering Discontinuity at Material Interfaces in Electronic Packages

被引：9

作者：

Ma, Lulu ^{[1
,3
]}

Joshi, Rahul ^{[2
]}

Newman, Keith Keith ^{[2
]}

Fan, Xuejun ^{[1
]}

机构：

[1] Lamar Univ, Dept Mech Engn, Beaumont, TX 77710 USA

[2] AMD, 7171 Southwest Pkwy, Austin, TX 78735 USA

[3] Tianjin Univ, Dept Mech, Tianjin 300350, Peoples R China

来源：

2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2019年

关键词：

electronic package; finite element modeling; generalized solubility; moisture diffusion; normalization; VAPOR-PRESSURE;

D O I：

10.1109/ECTC.2019.00127

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The modeling of moisture diffusion plays an important role for the integrity and reliability of electronic packages. In this paper, a new normalization approach and its implementation using ANSYS finite element analysis software are presented. Such an approach can solve the diffusion problem with varying temperature and humidity. Two different options in moisture diffusion modeling provided by ANSYS are discussed. As a validation, the numerical results are compared to that using the conventional normalization approach.

引用

页码：806 / 810

页数：5

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