A DSP architecture for cochlear implants

被引：0

作者：

Marsman, Eric D. } ^{[1
]}

Senger, Robert A.

Carichner, Gordon A.

Kubba, Sundus

McCorquodale, Michael S.

机构：

[1] Univ Michigan, Ann Arbor, MI 48109 USA

[2] Mobius Micrpsyst Inc, Detroit, MI USA

[3] Univ Utah, Salt Lake City, UT 84112 USA

来源：

2006 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOLS 1-11, PROCEEDINGS | 2006年

关键词：

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

This paper describes a low-power DSP architecture for use in cochlear implants. The microsystem, fabricated in TSMC 0.18 mu m CMOS, consumes 1.79mW from a 1.2V supply and occupies an area of 9.18mm(2) while providing the necessary programmability for high speech comprehension by patients. Standby power consumption is 330 mu W.

引用

页码：657 / 660

页数：4

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