The effect of Cu addition on the electrochemical corrosion and passivation behavior of stainless steels

被引：192
作者：
Oguzie, Emeka E. [1 ,2 ]
Li, Jibiao [2 ]
Liu, Yongqian [3 ]
Chen, Demin [3 ]
Li, Ying [2 ]
Yang, Ke [3 ]
Wang, Fuhui [2 ]
机构：
[1] Fed Univ Technol Owerri, Dept Chem, Electrochem & Mat Sci Res Lab, Owerri, Nigeria
[2] Chinese Acad Sci, Inst Met Res, State Key Lab Corros & Protect, Shenyang 110015, Peoples R China
[3] Chinese Acad Sci, Inst Met Res, Ctr Engn Mat, Shenyang 110016, Peoples R China
来源：
ELECTROCHIMICA ACTA | 2010年 / 55卷 / 17期
关键词：
Cu addition; Corrosion; Passivity; Semiconductor properties; Mott-Schottky equation; IRON-CHROMIUM-ALLOYS; ANODIC-DISSOLUTION; ANTIBACTERIAL PROPERTIES; IMPEDANCE MEASUREMENTS; ELECTRONIC-STRUCTURE; ACID-SOLUTIONS; COPPER; FILMS; PASSIVITY; CHLORIDE;
D O I：
10.1016/j.electacta.2010.04.015
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
The effect of Cu addition on the electrochemical corrosion behavior of austenitic, ferritic and martensitic stainless steels in both the active and passive state was investigated by potentiodynamic polarization and electrochemical impedance spectroscopy in 0.1 M H(2)SO(4). The semiconducting properties of the passive films were investigated by capacitance measurements by using the Mott-Schottky approach. Cu addition generally improved corrosion resistance and facilitated passivation but did not notably affect the resistance of the passive films. Capacitance results revealed that the passive films behave as n-type and p-type semiconductors at potentials below and above the flatband potential, respectively. Cu addition caused an increase in the donor and acceptor densities, which we have attempted to correlate with the passive film stability. (C) 2010 Elsevier Ltd. All rights reserved.
引用
收藏
页码：5028 / 5035
页数：8
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