Thermal stability of sputtered Cu/304 stainless steel multilayer films

被引：6

作者：

Zhang, X. ^{[1
]}

Schulze, R. K.

Wang, H.

Misra, A.

机构：

[1] Texas A&M Univ, Dept Mech Engn, College Stn, TX 77843 USA

[2] Los Alamos Natl Lab, Los Alamos, NM 87545 USA

[3] Texas A&M Univ, Dept Elect & Comp Engn, College Stn, TX 77843 USA

来源：

JOURNAL OF APPLIED PHYSICS | 2007年 / 101卷 / 12期

基金：

美国国家科学基金会;

关键词：

D O I：

10.1063/1.2748628

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We report on the thermal stability of sputter-deposited Cu/304 stainless steel nanoscale multilayer films. For individual layer thickness of approximately 70 nm, the layered morphology was stable up to 600 degrees C with no significant change in the hardness. The stainless steel layer had a duplex bcc+fcc structure that was also preserved in annealed films. After annealing at temperatures of 650 degrees C or higher, the hardness of these multilayer films decreased from 4.75 to 3.4 GPa due to morphological evolution from layers to equiaxed grains and coarsening of the nanolayers. (c) 2007 American Institute of Physics.

引用

页数：5

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