Ultra-compact G-band 16way Power Splitter/Combiner Module Fabricated Through a New Method of 3D-Copper Additive Manufacturing
被引:0
作者:
Kazemi, H.
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机构:
Nuvotronics LLC, Camarillo, CA USANuvotronics LLC, Camarillo, CA USA
Kazemi, H.
[1
]
Miller, D.
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h-index: 0
机构:
Nuvotronics LLC, Camarillo, CA USANuvotronics LLC, Camarillo, CA USA
Miller, D.
[1
]
Mohan, A.
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h-index: 0
机构:
Triquint, Newbury Pk, CA USANuvotronics LLC, Camarillo, CA USA
Mohan, A.
[4
]
Jin, Y.
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h-index: 0
机构:
Nuvotronics LLC, Radford, VA USANuvotronics LLC, Camarillo, CA USA
Jin, Y.
[2
]
Crawford, M.
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机构:
Nuvotronics LLC, Radford, VA USANuvotronics LLC, Camarillo, CA USA
Crawford, M.
[2
]
Wagenseil, M.
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机构:
Nuvotronics LLC, Durham, NC USANuvotronics LLC, Camarillo, CA USA
Wagenseil, M.
[3
]
Long, S.
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机构:
S2 Engn & Consulting, Camarillo, CA USANuvotronics LLC, Camarillo, CA USA
Long, S.
[5
]
机构:
[1] Nuvotronics LLC, Camarillo, CA USA
[2] Nuvotronics LLC, Radford, VA USA
[3] Nuvotronics LLC, Durham, NC USA
[4] Triquint, Newbury Pk, CA USA
[5] S2 Engn & Consulting, Camarillo, CA USA
来源:
2015 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS)
|
2015年
关键词:
Power amplifier;
power combiner;
additive manufacturing;
copper micromachining;
WR4;
G-band;
waveguide binary split;
sub millimeter wave components;
TECHNOLOGY;
D O I:
暂无
中图分类号:
TP301 [理论、方法];
学科分类号:
081202 ;
摘要:
A new design and fabrication methodology for mmw and sub-mmw components is defined. The 3D copper additive manufacturing process is described with a full 3D volumetric 16 way splitter-combiner demonstration at G-band frequency range. The WR4 combiner is folded through design compaction and then sliced through its Z-direction and fabricated as slices to form a final 23 slice stack. The stack was then measured at 200-270 GHz using a WR4 test-through waveguide that traverses through the entire stack. The insertion loss measured at only 0.03 dB/mm showcasing its low loss characteristics. The 16 way splitter -combiner back to back was also tested using micro-machined WR4 through lines, fabricated and measured at an overall insertion loss of 4dB. The results highlight the success of the volumetric design in which a 16 way combiner measures < 2dB insertion loss and occupies no more than 3.6 cm(3) volume.
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页数:3
相关论文
共 3 条
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Hacker J, 2010, IEEE MTT S INT MICR, P1126, DOI 10.1109/MWSYM.2010.5517225
[2]
Oliver J.M., 2013, 2013 IEEE MTT S INT, V3, P1