Ultra-compact G-band 16way Power Splitter/Combiner Module Fabricated Through a New Method of 3D-Copper Additive Manufacturing

被引:0
作者
Kazemi, H. [1 ]
Miller, D. [1 ]
Mohan, A. [4 ]
Jin, Y. [2 ]
Crawford, M. [2 ]
Wagenseil, M. [3 ]
Long, S. [5 ]
机构
[1] Nuvotronics LLC, Camarillo, CA USA
[2] Nuvotronics LLC, Radford, VA USA
[3] Nuvotronics LLC, Durham, NC USA
[4] Triquint, Newbury Pk, CA USA
[5] S2 Engn & Consulting, Camarillo, CA USA
来源
2015 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS) | 2015年
关键词
Power amplifier; power combiner; additive manufacturing; copper micromachining; WR4; G-band; waveguide binary split; sub millimeter wave components; TECHNOLOGY;
D O I
暂无
中图分类号
TP301 [理论、方法];
学科分类号
081202 ;
摘要
A new design and fabrication methodology for mmw and sub-mmw components is defined. The 3D copper additive manufacturing process is described with a full 3D volumetric 16 way splitter-combiner demonstration at G-band frequency range. The WR4 combiner is folded through design compaction and then sliced through its Z-direction and fabricated as slices to form a final 23 slice stack. The stack was then measured at 200-270 GHz using a WR4 test-through waveguide that traverses through the entire stack. The insertion loss measured at only 0.03 dB/mm showcasing its low loss characteristics. The 16 way splitter -combiner back to back was also tested using micro-machined WR4 through lines, fabricated and measured at an overall insertion loss of 4dB. The results highlight the success of the volumetric design in which a 16 way combiner measures < 2dB insertion loss and occupies no more than 3.6 cm(3) volume.
引用
收藏
页数:3
相关论文
共 3 条
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