CAPACITIVE SENSOR FUSION: CO-FABRICATED X/Y AND Z-AXIS ACCELEROMETERS, PRESSURE SENSOR, THERMOMETER

被引：0

作者：

Hong, V. A. ^{[1
]}

Stehle, J. ^{[2
]}

Ahn, C. H. ^{[1
]}

Heinz, D. B. ^{[1
]}

Yama, G. ^{[2
]}

Kim, B. ^{[2
]}

O'Brien, G. J. ^{[2
]}

Kenny, T. W. ^{[1
]}

机构：

[1] Stanford Univ, Stanford, CA 94305 USA

[2] Robert Bosch RTC, Palo Alto, CA USA

来源：

2015 TRANSDUCERS - 2015 18TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS) | 2015年

关键词：

Sensor fusion; semiconductor device packaging; STABILITY;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a capacitive X/Y and Z-axis accelerometer, pressure sensor, and resonant thermometer, co-fabricated in a single die using an ultra-clean, high-temperature, wafer-scale, production-compatible encapsulation process. This process is free of bond rings and getter areas, thereby reducing overall die size to a minimum. Utilizing a process that allows for nitride and silicon etch stops, we show that it is possible to design high-sensitivity pressure sensors and accelerometers with very little cross-sensitivity. In addition, remaining sensitivities to environmental effects, such as temperature, can be compensated to reveal a suite of on-chip high-performance sensors that is accurate over temperature. All of this is accomplished in a process similar to current high-volume production processes in industry.

引用

页码：295 / 298

页数：4

共 14 条

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