Predicting tensile properties of the bulk 96.5Sn-3.5Ag lead-free solder

Equations are presented for predicting tensile properties as functions of temperature and strain rate for the bulk-eutectic 96.5Sn-3.5Ag lead-free solder. At 25degreesC, we obtained 49.0 GPa for Young's modulus based on acoustic measurements, which is higher than most of those measured by tensile tests that are subject to viscoelastic creep; 23.1 MPa and 26.3 MPa for yield stress and ultimate tensile strength (UTS) of specimens that are cast, annealed, and aged at a strain rate of 2.0 x 10(-4)s(-1); 48.7% for total elongation, which is larger than most of the reported values. The presence of "initial defects" in the specimens, such as porosity and void, might cause the reduction in measured total elongations.