Multiscale Simulation of the Development Process in Electron Beam Lithography

被引:1
作者
Yasuda, Masaaki [1 ]
Hitomi, Sho [1 ]
Kawata, Hiroaki [1 ]
Hirai, Yoshihiko [1 ]
机构
[1] Osaka Prefecture Univ, Dept Phys & Elect, Naka Ku, 1-1 Gakuen Cho, Sakai, Osaka 5998531, Japan
基金
日本学术振兴会;
关键词
Multiscale simulation; Electron beam lithography; Cell removal simulation; Molecular dynamics; Monte Carlo simulation; LINE EDGE ROUGHNESS; RESIST;
D O I
10.2494/photopolymer.30.205
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
Multiscale simulations are perfored to study the development process in electron beam lithography. The whole pattern profiles are calculated with the cell removal simulation. The pattern profiles are shown to reflect the electron scattering manner in the resist. The local pattern structures are then studied by molecular dynamics simulation. The residual layer with a lot of voids, the residual polymer chains and concave sidewall reflecting the molecular structures are observed as typical atomic-scale pattern structures. The size of the pattern roughness is observed to be comparable with the molecular size of the resist. The diffusion process of the resist molecules among the developer molecules is also analyzed.
引用
收藏
页码:205 / 209
页数:5
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