Recovery of silicon powder from kerf loss slurry by centrifugation

被引：142

作者：

Lin, Yen-Chih ^{[1
]}

Wang, Teng-Yu ^{[1
]}

Lan, Chung-Wen ^{[1
]}

Tai, Clifford Y. ^{[1
]}

机构：

[1] Natl Taiwan Univ, Dept Chem Engn, Taipei 106, Taiwan

来源：

POWDER TECHNOLOGY | 2010年 / 200卷 / 03期

关键词：

Silicon kerfs; Wire-saw process; Centrifugal separation; Purity; Yield;

D O I：

10.1016/j.powtec.2010.02.028

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

A feasibility study on recovering silicon powder from slurry containing silicon carbide abrasives, silicon kerfs, and iron fragments generated by slicing silicon ingots in the wire-saw process was conducted. The glycol solution and iron fragments in the slurry were removed using acetone and nitric acid, respectively. Then, centrifugation was applied to separate the silicon kerfs and silicon carbide abrasives using a heavy-liquid with a density between that of silicon and silicon carbide. The effects of several operational variables on the purity and yield of silicon kerfs were systematically investigated, including solid volume fraction, heavy-liquid density, number of centrifugation steps, and centrifugation time. Additionally, the effects of agitation for dispersing particles in the heavy-liquid before centrifugation were also studied. The purity and yield of Si product at specified conditions are reported. (C) 2010 Elsevier B.V. All rights reserved.

引用

页码：216 / 223

页数：8

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