Monolithic 3-D Integration

被引：47
作者：
Bishop, Mindy D. [1 ]
Wong, H-S. Philip [2 ,3 ]
Mitra, Subhasish [4 ,5 ,6 ,7 ]
Shulaker, Max M. [8 ,9 ]
机构：
[1] MIT, 77 Massachusetts Ave, Cambridge, MA 02139 USA
[2] Stanford Univ, Sch Engn, Stanford, CA 94305 USA
[3] Stanford Univ, Elect Engn, Stanford, CA 94305 USA
[4] Stanford Univ, Elect Engn & Comp Sci, Stanford, CA 94305 USA
[5] Stanford Univ, Stanford Robust Syst Grp, Stanford, CA 94305 USA
[6] Stanford Univ, Computat Focus Area, Stanford SystemX Alliance, Stanford, CA 94305 USA
[7] Stanford Univ, Inst Neurosci, Stanford, CA 94305 USA
[8] MIT, Dept Elect Engn & Comp Sci, Cambridge, MA 02139 USA
[9] MIT, NOVELS Novel Elect Syst Grp, 77 Massachusetts Ave, Cambridge, MA 02139 USA
来源：
IEEE MICRO | 2019年 / 39卷 / 06期
基金：
美国国家科学基金会;
关键词：
THERMAL-PROPERTIES; DESIGN;
D O I：
10.1109/MM.2019.2942982
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
The demands of future applications in computing (from self-driving cars to bioinformatics) overwhelm the projected capabilities of current electronic systems. The need to process unprecedented amounts of loosely structured data is driving the push for ultradense and fine-grained integration of traditionally off-chip components (e.g., sensors, memories) with energy-efficient computation units-all within a single chip. Monolithic 3-D integration is a leading approach for building such future systems, as it naturally enables ultradense connectivity between various heterogeneous technologies inside a single chip. This article discusses exciting recent progress toward realizing monolithic 3-D systems and elucidates key benefits that these new systems offer. Monolithic 3-D integration promises to enable the next wave of gains in performance (both energy and speed) for coming generations of applications as well as provides the means for developing rich additional functionalities such as sensing-immersed-in-computation that lie beyond the scope of traditional computing today.
引用
收藏
页码：16 / 27
页数：12
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