Organotin amine complexes as latent catalysts for epoxy resins

被引：0
作者：
Smith, JDB [1 ]
机构：
[1] Westinghouse Sci & Technol Ctr, Pittsburgh, PA 15235 USA
来源：
PROCEEDINGS: ELECTRICAL INSULATION CONFERENCE AND ELECTRICAL MANUFACTURING & COIL WINDING CONFERENCE | 1997年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Several Organotin-amine molecular complexes have been synthesized and evaluated as latent catalysts and accelerators for curing epoxy and epoxy-anhydride resins. With epoxy-anhydride resin formulations, the addition of similar to 0.10% of some of these organotin-amine complexes gives fast gel times at 150-175 degrees C combined with reasonably good storage stability at room temperature and low power factors in cured resin samples (measured at 150 degrees C).
引用
收藏
页码：239 / 244
页数：6
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