Simulation of gate lag and current collapse in gallium nitride field-effect transistors

被引:48
作者
Braga, N [1 ]
Mickevicius, R
Gaska, R
Shur, MS
Khan, MA
Simin, G
机构
[1] Integrated Syst Engn Inc, San Jose, CA 95113 USA
[2] Sensor Elect Technol Inc, Columbia, SC 29209 USA
[3] Rensselaer Polytech Inst, Dept Elect Comp & Syst Engn, Troy, NY 12180 USA
[4] Univ S Carolina, Dept Elect Engn, Columbia, SC 29208 USA
关键词
D O I
10.1063/1.1823018
中图分类号
O59 [应用物理学];
学科分类号
摘要
Results of two-dimensional numerical simulations of gate lag and current collapse in GaN heterostructure field-effect transistors are presented. Simulation results clearly show that current collapse takes place only if an enhanced trapping occurs under the gate edges. Hot electrons play an instrumental role in the collapse mechanism. The simulation results also link the current collapse with electrons spreading into the buffer layer and confirm that a better electron localization (as in a double heterostructure field-effect transistor) can dramatically reduce current collapse. (C) 2004 American Institute of Physics.
引用
收藏
页码:4780 / 4782
页数:3
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