Influence of interface thermal resistance on thermal conductivity of SiC/Al composites

被引:36
作者
Liu, Qiuyuan [1 ,2 ]
Wang, Feng [2 ]
Shen, Wei [2 ]
Qiu, Xiaopan [2 ]
He, Zhiyong [2 ]
Zhang, Qifu [2 ]
Xie, Zhipeng [1 ]
机构
[1] Tsinghua Univ, Sch Mat Sci & Engn, State Key Lab New Ceram & Fine Proc, Beijing 100084, Peoples R China
[2] China Iron & Steel Res Inst Grp, Beijing 100081, Peoples R China
关键词
SiC/Al composite; Cerium; Thermal conductivity; Digital image processing; Finite-element grid model; METAL-MATRIX COMPOSITES; PRESSURELESS INFILTRATION; MECHANICAL-PROPERTIES; ALUMINUM; MICROSTRUCTURE; REINFORCEMENT; PARTICULATE; MANAGEMENT; EXPANSION; SIZE;
D O I
10.1016/j.ceramint.2019.07.358
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
SiC/Al composites were fabricated via a pressureless infiltration process, using SiC powder and aluminum alloy (3% Mg, 3% Mg-Cc) as the main raw materials. The effect of introducing the rare-earth element Ce, on the thermal conductivity (TC) of the SiC/Al composites, was investigated. The results showed that the introduction of Ce improved the TC of the SiC/Al composites; the TC of the composite with 0.5% Ce was as high as 180 W/(mK). An analysis of the true microscopic structure of the sample was performed using digital image processing to facilitate finite-element calculation of the TC of the SiC/Al composites. The TC of the composite was analyzed and quantified by comparing the simulated and test results. An equation for calculating the Ce-modified interface thermal resistance influence coefficient was proposed.
引用
收藏
页码:23815 / 23819
页数:5
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