Combination of Thick-Film Hybrid Technology and Polymer Additive Manufacturing for High-Performance Mechatronic Integrated Devices

被引：4
|
作者：
Ackstaller, Thomas [1 ]
Lorenz, Lukas [1 ]
Nieweglowski, Krzysztof [1 ]
Bock, Karlheinz [1 ]
机构：
[1] Tech Univ Dresden, Inst Elect Packaging Technol, Dept Elect Engn & Informat Technol, Dresden, Germany
来源：
2019 42ND INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE) | 2019年
关键词：
D O I：
10.1109/isse.2019.8810205
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In order to build high performance 3D-Opto-mechatronic integrated device packages, we demonstrate the direct stereolithographic printing of polymeric resins onto ceramic substrate. The effects of adhesion are examined, the lower size limit for structures is found and the adhesion strength is measured. With the results a suitable combination of materials can be chosen for creating a hybrid package for a 3D-Opto-mechatronic integrated device. A prototype of an optical coupler is printed successfully and shows one possible application.
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页数：6
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