Design, implementation, and testing of miniaturized electromagnetic bandgap structures for broadband switching noise mitigation in high-speed PCBs

被引:21
作者
Shahparnia, Shahrooz [1 ]
Ramahi, Omar M.
机构
[1] Univ Maryland, Dept Elect & Comp Engn, College Pk, MD 20742 USA
[2] Univ Waterloo, Dept Elect & Comp Engn, Waterloo, ON N2L 3G1, Canada
来源
IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2007年 / 30卷 / 02期
关键词
electromagnetic bandgap structures; electromagnetic noise; electronic packages; high-impedance surfaces; printed-circuit boards (PCBs); switching noise;
D O I
10.1109/TADVP.2007.895612
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In recent years, advances in CMOS technology, resulted in devices with higher switching speeds, lower power supply voltages, and higher package densities. Lowering the power supply voltages and hence the power consumption of a single transistor, has been possible due to the fact that these new technologies are able to provide smaller and faster transistors with lower threshold levels. The benefits associated with lowering the threshold levels of the transistors used in a given device comes at a high-price, specifically the decrease of immunity of such device to noise and fluctuations of the power supply voltages. This paper covers the concept of embedding electromagnetic bandgap (EBG) structures in conventional power distribution networks in order to increase the immunity of the circuits that feed from such networks to noise and voltage fluctuations. Underlying theories of embedded EBG (EEBG) structures and design methodologies are presented. Finally, in order to provide immunity to high-bandwidth noise, voltage fluctuations and radiation, new EEBG configurations, topologies and miniaturized structures with ultra wide-bandwidth are introduced and their efficacy is demonstrated.
引用
收藏
页码:171 / 179
页数:9
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