The highly twinned grain boundary network formation during grain boundary engineering

被引：53

作者：

Liu, Tingguang ^{[1
]}

Xia, Shuang ^{[1
,2
]}

Li, Hui ^{[2
]}

Zhou, Bangxin ^{[1
,2
]}

Bai, Qin ^{[2
]}

机构：

[1] Shanghai Univ, Inst Mat, Shanghai 200072, Peoples R China

[2] Shanghai Univ, Key Lab Microstruct, Shanghai 200444, Peoples R China

来源：

MATERIALS LETTERS | 2014年 / 133卷

基金：

美国国家科学基金会;

关键词：

Grain boundary; Recrystallization; Grain boundary engineering; Twinning; Grain-cluster; INTERGRANULAR CORROSION; CHARACTER-DISTRIBUTION;

D O I：

10.1016/j.matlet.2014.06.166

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Grain boundary (GB) engineering was carried out on a Ni-based alloy with pre-precipitated carbides at GBs. Microstructure with coexistence of Sigma 3(n) boundaries formed during annealing and traces of disappeared original GBs were observed during GB-engineering. The newly formed Sigma 3(n) boundaries are in different positions with that of disappeared original GBs, which indicates the recrystallization front GBs moved into the deformed matrix and swept away original GBs. It is a typical recrystallization process rather than GB decomposition. Strain induced boundary migration initiated the recrystallization. Grain-cluster formed with the continuous occurrence of twinning-events in the wake of the migrating recrystallization front GBs during sweeping away the deformed matrix. Finally large grain-clusters with highly twinned interconnecting Sigma 3(n) boundaries were formed. (C) 2014 Elsevier B.V. All rights reserved.

引用

页码：97 / 100

页数：4

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