Basic Study on Flow and Heat Transfer Performance of Pulsating Air Flow for Application to Electronics Cooling

Our study tries to apply a pulsating airflow to one of a heat transfer enhancement method in electronic equipment. In recent electronic equipment, a lot of electrical components are mounted while their performance increases and a level of heat dissipation becomes higher. The components cause flow separation of the cooling air and heat transfer performance rear the components generally decreases. Therefore the mounting position of the heating components is restricted in order to avoid the separated flow region. In order to improve the heat transfer rear the components, we are now focusing on the flow pulsation. By generating the flow pulsation of the airflow, the development of the separated flow region rear the components may be inhibited and the heat transfer performance rear the components may be improved. In addition, the flow pulsation can be generated by controlling the input power of the cooling fan easily. From these backgrounds, we tried to investigate flow and heat transfer characteristics of the pulsation flow around the components. In this report, we developed the experimental system in order to evaluate flow and heat transfer performance of the pulsation flow around the electrical components experimentally. By using the experimental system, we tried to evaluate the cooling performance of the pulsation flow around cylindrical blocks, which simulates electrical components. Through the experiment, we evaluated the effectiveness of the pulsation flow as the cooling method of electronic equipment.