Interface Structure of High Strength and High Conductivity Cu-Nb Microcomposites

High strength and high conductivity Cu-Nb microcomoposites were fabricated by Accumulative Bundling and Drawing (ABD) process. The microstructure of the composite and interface diffusion were observed during four compositing processes by SEM and EDS. Crystal orientation evolution of Nb filaments and Cu matrix were characterized by XRD at extrusion and drawing conditions of different compositing processes. The interface structure and crystal orientation were analyzed by HRTEM and IFFT. Results show that the diffusion between Cu/Nb interfaces occurs during the 3rd compositing. The texture of Nb fibers is <110> orientation while for Cu matrix is <111> orientation after the severe plastic deformation. And atomic planes (111)(cu) are parallel to (110)(Nb) with an angular deviation of 18.7 degrees, which means that a crystal mismatch dislocation appears at interval of every six Cu (111) crystal planes.