Three-dimensional memory module for space application

被引：0

作者：

Yamada, N ^{[1
]}

Kuboyama, S ^{[1
]}

Matsuda, S ^{[1
]}

Sato, K ^{[1
]}

Hatada, K ^{[1
]}

机构：

[1] Natl Space Dev Agcy Japan, Tsukuba, Ibaraki 3058505, Japan

来源：

PROCEEDINGS OF THE EUROPEAN SPACE COMPONENTS CONFERENCE - ESCCON 2002 | 2002年 / 507卷

关键词：

D O I：

暂无

中图分类号：

V [航空、航天];

学科分类号：

08 ; 0825 ;

摘要：

NASDA is developing a new high-speed, onboard microcomputer for space applications, such as micro satellites and space robots, which require high-performance MPUs and high-speed, high-volume memory systems. We selected the TZ-CSP (Fig. 1 Tape z-Axis chip-scale package) technology, a three-dimensional (3-D) assembly technology, to build a high-speed, high-performance memory system. This study investigated the long-term reliability and temperature characteristics of TZ-CSP diodes and resistors to examine their applicability to space systems. We conducted basic thermal cycle tests and moisture resistance tests and shock, vibration, and thermal shock tests on TZ-CSP samples in conformity with MIL-STD-202.

引用

页码：227 / 231

页数：5

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