Cost and makespan aware workflow scheduling in IaaS clouds using hybrid spider monkey optimization

被引:27
|
作者
Rizvi, Naela [1 ]
Dharavath, Ramesh [1 ]
Edla, Damodar Reddy [2 ]
机构
[1] Indian Inst Technol ISM, Dept Comp Sci & Engn, Dhanbad 826004, Jharkhand, India
[2] Natl Inst Technol, Ponda 403401, Goa, India
关键词
Workflow scheduling; Deadline; Penalty function; Makespan; Cloud computing; GENETIC ALGORITHM;
D O I
10.1016/j.simpat.2021.102328
中图分类号
TP39 [计算机的应用];
学科分类号
081203 ; 0835 ;
摘要
The researcher?s predilection towards the concerned infinite resources and the dynamic provisioning on rental premises encourages the scheduling of complex scientific applications in the cloud. The scheduling of workflows in the cloud is constrained to QoS parameters. Many heuristic and meta-heuristic algorithms are widely investigated for the QoS constrained workflow scheduling problem. However, it is still an open area of research, as most of the existing techniques concentrate on minimization of either cost or time and ignores the optimization of multiple QoS constraints simultaneously. To address this problem, in this paper, a Hybrid Spider Monkey Optimization (HSMO) algorithm has been proposed. The proposed algorithm optimizes the makespan and the cost while satisfying the budget and deadline constraints. The proposed algorithm is the hybridization of recently developed SMO and the other popular heuristic BDSD algorithm. BDSD is a budget and deadline constrained algorithm, which guides HSMO in generating a feasible schedule. Moreover, the proposed strategy involves the penalty function to restrict selecting those solutions that fail to satisfy the QoS constraints. Experimental results demonstrate the effectiveness of HSMO over existing ABC, Bi-Criteria PSO, and BDSD algorithms.
引用
收藏
页数:24
相关论文
共 50 条
  • [1] Cost and makespan-aware workflow scheduling in hybrid clouds
    Zhou, Junlong
    Wang, Tian
    Cong, Peijin
    Lu, Pingping
    Wei, Tongquan
    Chen, Mingsong
    JOURNAL OF SYSTEMS ARCHITECTURE, 2019, 100
  • [2] A Review of Cost and Makespan-Aware Workflow Scheduling in Clouds
    Lu, Pingping
    Zhang, Gongxuan
    Zhu, Zhaomeng
    Zhou, Xiumin
    Sun, Jin
    Zhou, Junlong
    JOURNAL OF CIRCUITS SYSTEMS AND COMPUTERS, 2019, 28 (06)
  • [3] A Cost-Aware Scheduling Algorithm for Reliable Workflow in IaaS Clouds
    Ye, Lingjuan
    Xia, Yuanqing
    Yang, Liwen
    PROCEEDINGS OF THE 33RD CHINESE CONTROL AND DECISION CONFERENCE (CCDC 2021), 2021, : 275 - 280
  • [4] Workflow Scheduling in Clouds using Pareto Dominance for Makespan, Cost and Energy
    Alrammah, Huda
    Gu, Yi
    IEEE INTERNATIONAL CONFERENCE ON COMMUNICATIONS (ICC 2021), 2021,
  • [5] Budget aware scheduling algorithm for workflow applications in IaaS clouds
    K. Kalyan Chakravarthi
    L. Shyamala
    V. Vaidehi
    Cluster Computing, 2020, 23 : 3405 - 3419
  • [6] Budget aware scheduling algorithm for workflow applications in IaaS clouds
    Chakravarthi, K.
    Shyamala, L.
    Vaidehi, V.
    CLUSTER COMPUTING-THE JOURNAL OF NETWORKS SOFTWARE TOOLS AND APPLICATIONS, 2020, 23 (04): : 3405 - 3419
  • [7] HCOC: a cost optimization algorithm for workflow scheduling in hybrid clouds
    Fernando Bittencourt, Luiz
    Roberto Mauro Madeira, Edmundo
    JOURNAL OF INTERNET SERVICES AND APPLICATIONS, 2011, 2 : 207 - 227
  • [8] Cost-aware and privacy-aware workflow scheduling strategy in hybrid clouds
    Wen Y.
    Wang Z.
    Liu J.
    Xu X.
    Chen A.
    Cao B.
    Jisuanji Jicheng Zhizao Xitong/Computer Integrated Manufacturing Systems, CIMS, 2020, 26 (06): : 1582 - 1588
  • [9] Makespan-Cost-Reliability-Optimized Workflow Scheduling Using Evolutionary Techniques in Clouds
    Zhou, Xiumin
    Zhang, Gongxuan
    Wang, Tian
    Zhang, Mingyue
    Wang, Xiji
    Zhang, Wei
    JOURNAL OF CIRCUITS SYSTEMS AND COMPUTERS, 2020, 29 (10)
  • [10] Reliability-Aware and Energy-Efficient Workflow Scheduling in IaaS Clouds
    Ye, Lingjuan
    Xia, Yuanqing
    Tao, Siyuan
    Yan, Ce
    Gao, Runze
    Zhan, Yufeng
    IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING, 2023, 20 (03) : 2156 - 2169