Improved Adhesion of Plating Copper Metal on Various Substrates by Controlled Interface of Ag Nanoparticles and Thin Polymer Layer

被引：0

作者：

Fukazawa, Norimasa ^{[1
]}

Fujikawa, Wataru ^{[1
]}

Murakawa, Akira ^{[1
]}

Shirakami, Jun ^{[1
]}

机构：

[1] DIC Corp, Prod Innovat Ctr, Core Value Dev Project, 1-3 Takaishi, Osaka, Japan

来源：

2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP) | 2017年

关键词：

Adhesion of dis-similar materials; Un-roughening substrates; Adhesive thin polymer layer; Silver nanoparticles; Copper Plating;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Improvement of adhesion strength of plating metals on un-roughening flat surfaces was achieved by controlling the interface between metals and substrates. The key factor of this technique is designing combination interface which consists of thin polymer adhesive layer and originally synthesized silver nanoparticles. The polymer adhesive layer is placed on flat surface of substrate and the silver nanoparticles were coated on it. The silver nanoparticles are tightly fixed on substrate, as a result of reaction between the polymer dispersant of silver nanoparticles and the polymer of adhesive layer. The fixed silver nanoparticles' layer works as a base for plating metal, as well as an electro-less plating catalyst or an electrode for successive metal plating process.

引用

页码：345 / 350

页数：6