Tribological and Adhesion Properties of CVD Diamond Films Grown on Steel with a Cr-N Inter layer

被引：0

作者：

Laikhtman, A. ^{[1
]}

Rapoport, L. ^{[1
]}

Perfilyev, V. ^{[1
]}

Moshkovich, A. ^{[1
]}

Akhvlediani, R. ^{[2
]}

Hoffman, A. ^{[2
]}

机构：

[1] Holon Inst Technol, Dept Sci, 52 Golomb St, IL-58102 Holon, Israel

[2] Tech Israel Inst Technol, Schulich Fac Chem, Haifa 32000, Israel

来源：

ADVANCED MATERIALS AND NANOTECHNOLOGY, PROCEEDINGS | 2009年 / 1151卷

关键词：

diamond; steel; friction; adhesion; CHEMICAL-VAPOR-DEPOSITION; INITIAL-STAGES; BEHAVIOR; WEAR;

D O I：

暂无

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

In the present work we investigate friction and adhesion properties of microcrystalline diamond films grown on steel substrates with a Cr-N interlayer prepared at 500 degrees C and 800 degrees C. Scratch tests were performed at indentation loads of 1-4 N and sliding velocity of 0.08 mm/s. The friction coefficient and wear loss were assessed. The diamond film structure and composition are analyzed using different microscopic and spectroscopic techniques. The effect of the diamond structure on adhesion of the deposited diamond films to the substrates, as well as the friction coefficient and wear were evaluated. Continuous, good crystalline quality diamond films with a similar phase content and surface morphology were obtained on both, high and low temperature nitridated substrates, provide similar tribological properties of films. Thus, the temperature of interlayer preparation does not affect the friction coefficient and the size of wear profiles. Substantially different results were obtained when evaluating the adhesion properties of diamond films to the steel substrate. It was found that the diamond film deposited on the Cr-N interlayer prepared at 800 degrees C shows the best adhesion. The diamond film was stable without visible cracks around the wear track during all scratch tests with different indentation loads. Weak adhesion was observed for the diamond film grown on the Cr-N interlayer prepared at a lower temperature (500 degrees C) for which cracking and delamination of the films took place at loads of 1 N-1.2 N.

引用

页码：157 / +

页数：2

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