Electrochemistry of copper in chemical mechanical planarization (CMP) slurries containing glycine and hydrogen peroxide

被引：0

作者：

Aksu, S ^{[1
]}

Doyle, FM ^{[1
]}

机构：

[1] Univ Calif Berkeley, Dept Mat Sci & Engn, Berkeley, CA 94720 USA

来源：

CHEMICAL MECHANICAL PLANARIZATION V | 2002年 / 2002卷 / 01期

关键词：

D O I：

暂无

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

This study aims to improve our understanding of the removal mechanisms during copper CMP using hydrogen peroxide-glycine based slurries. First, copper dissolution behavior was examined in aqueous glycine solutions in the absence of H2O2 by correlating the results of potentiodynamic polarization experiments with the appropriate potential-pH diagram for the copper-water-glycine system. The polishing behavior in the absence of H2O2 was examined by in-situ polarization experiments. Finally, weight loss and polishing experiments were conducted to investigate the electrochemistry of copper in glycine solutions and slurries with different amounts H2O2.

引用

页码：79 / 90

页数：12

共 21 条

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