Evaluation of SAC solder joint thermomechanical fatigue in different types of components

被引：2

作者：

Ben Romdhane, E. ^{[1
,2
]}

Roumanille, P. ^{[1
]}

Guedon-Gracia, A. ^{[2
]}

Pin, S. ^{[1
]}

Nguyen, P. ^{[3
]}

Fremont, H. ^{[2
]}

机构：

[1] Inst Rech Technol St Exupery, Toulouse, France

[2] Univ Bordeaux, IMS Lab, Talence, France

[3] Elemca, Toulouse, France

来源：

2022 23RD INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME) | 2022年

关键词：

RECRYSTALLIZATION; INTERCONNECTIONS; FAILURE;

D O I：

10.1109/EuroSimE54907.2022.9758868

中图分类号：

Q6 [生物物理学];

学科分类号：

071011 ;

摘要：

As lead-free solder joints mechanical behavior is dependent on their microstructural characteristics, locations and geometries, developing accurate solder joint fatigue models implies correctly identifying the microstructural changes that undergo the solder alloy during thermal cycling. The present work aims at evaluating thermomechanical SAC (Sn-Ag-Cu) solder joints reliability by studying different types of components. Lifetimes data coupled to the microstructural investigation allowed us to study the microstructural process leading to SAC solder joints failure and to identify the different factors that must be considered in Finite Element Models (FEM) of electronic lead-free assemblies under thermomechanical loading. Tin recrystallization and strain-enhanced precipitate coarsening led to intergranular cracking in the solder joints, which was the first identified failure mode. A brittle interfacial crack that does not need tin grain recrystallization to propagate was the second detected cracking mode. The different behavior of one solder joint compared to another can be explained either by the presence of an unexpected microstructure highlighted during the characterization of the as-reflowed solder or by the design and the materials properties that unify each package.

引用

页数：6

共 13 条

[1] From early microstructural evolution to intergranular crack propagation in SAC solders under thermomechanical fatigue [J].

Ben Romdhane, E. ;

Roumanille, P. ;

Guedon-Gracia, A. ;

Pin, S. ;

Nguyen, P. ;

Fremont, H. .

MICROELECTRONICS RELIABILITY, 2021, 126

[2] Early microstructural indicators of crack initiation in lead-free solder joints under thermal cycling [J].

Ben Romdhane, E. ;

Roumanille, P. ;

Guedon-Gracia, A. ;

Pin, S. ;

Nguyen, P. ;

Fremont, H. .

IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, :2293-2301

[3] Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components [J].

Ben Romdhane, E. ;

Guedon-Gracia, A. ;

Pin, S. ;

Roumanille, P. ;

Fremont, H. .

MICROELECTRONICS RELIABILITY, 2020, 114

[4]

Deshpande A, 2019, INTSOC CONF THERMAL, P1026, DOI 10.1109/ITHERM.2019.8757405

[5] Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections-Part 2: Failure Mechanisms [J].

Hokka, Jussi ;

Mattila, Toni T. ;

Xu, Hongbo ;

Paulasto-Krockel, Mervi .

JOURNAL OF ELECTRONIC MATERIALS, 2013, 42 (06) :963-972

[6]

IPC - Association Connecting Electronics Industries, 2002, IPC9701 - Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

[7]

Lall P, 2018, INTSOC CONF THERMAL, P1357, DOI 10.1109/ITHERM.2018.8419496

[8] Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling [J].

Libot, J. B. ;

Alexis, J. ;

Dalverny, O. ;

Arnaud, L. ;

Milesi, P. ;

Dulondel, F. .

MICROELECTRONICS RELIABILITY, 2018, 83 :64-76

[9] The Stress State of BGA Solder Joints Influenced by the Grain Orientations of Neighboring Joints [J].

Lovberg, Andreas ;

Tegehall, Per-Erik .

2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), 2018, :882-889

[10]

Lövberg A, 2017, 2017 18TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME)

← 1 2 →