Miniaturized electromagnetic bandgap structures for ultrawide band switching noise mitigation in high-speed printed circuit boards and packages

被引：11

作者：

Shahparnia, S ^{[1
]}

Ramahi, OM ^{[1
]}

机构：

[1] Univ Maryland, Elect & Comp Engn Dept, College Pk, MD 20742 USA

来源：

ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2004年

关键词：

D O I：

10.1109/EPEP.2004.1407588

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, a novel design for electromagnetic bandgap structures embedded in packages is introduced. This design is able to mitigate switching noise in a power distribution network on an unprecedented range of frequencies, while having a very compact, miniaturized and practical structure.

引用

页码：211 / 214

页数：4

共 6 条

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IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2003, 13 (01) :21-23

[3] Simultaneous switching noise mitigation in PCB using cascaded high-impedance surfaces [J].

Shahparnia, S ;

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[4]

SHAHPARNIA S, 2004, P APPL COMP EL SOC A

[5]

SHAHPARNIA S, 2004, P 54 EL COMP TECHN C

[6]

SHAHPARNIA S, IN PRESS IEEE T ELEC

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