AgNi Alloy As a Suitable Barrier Layer Material for NbFeSb-Based Half-Heusler Thermoelectric Modules

被引:13
作者
Zhu, Jiaxu [1 ]
Liu, Fusheng [1 ]
Gong, Bo [1 ]
Wang, Xiao [1 ]
Ao, Weiqin [1 ]
Zhang, Chaohua [1 ]
Li, Yu [1 ]
Hu, Lipeng [1 ]
Xie, Heping [1 ]
Gu, Kunming [1 ]
Li, Junqin [1 ]
机构
[1] Shenzhen Univ, Guangdong Res Ctr Interfacial Engn Funct Mat, Shenzhen Key Lab Special Funct Mat,Shenzhen Engn, Coll Mat Sci & Engn,Inst Deep Underground Sci & G, Shenzhen 518060, Peoples R China
基金
中国国家自然科学基金;
关键词
Thermoelectric module; half-Heusler; contact resistance; intermetallic compounds; RECENT PROGRESS; SIGE ALLOY; PERFORMANCE; OPTIMIZATION; ENHANCEMENT; DESIGN; TI;
D O I
10.1007/s11664-019-07514-x
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
As a type of moderate- and high-temperature thermoelectric materials, half-Heusler thermoelectric materials have a unique advantage in terms of their power factors and mechanical properties, and the figure of merit (ZT) of FeNb0.88Hf0.12Sb reaches 1.0 at 600 degrees C. In this paper, after taking into account factors such as electrical conductivity, thermal conductivity, melting point, and metal activity, silver (Ag) was selected as the barrier layer material. The barrier layer and thermoelectric materials were welded together by atomic diffusion using spark plasma sintering. There was no obvious elemental diffusion on the connection surface after sintering, indicating that Ag did not impact the performance of FeNb0.88Hf0.12Sb. However, many cracks appeared on the joint surface during the aging process. In further experiments, we added a small amount of nickel (Ni) into the Ag to achieve a close connection between the barrier layer and FeNb0.88Hf0.12Sb. Moreover, we analyzed the interface of the intermetallic compounds after aging for 192 h, which showed that Ni3Nb and Ni6Nb7 compounds formed at the interface. The contact resistance was tested by a scanning probe method, and the resistivity of the barrier layer was determined to be 0.4 mu omega cm(2), which is far less than that of other barrier layers. Moreover, the connection strength was greater than 40 MPa. When Ag0.9Ni0.1 was used as the barrier layer to compose the half-Heusler thermoelectric module, the thermoelectric conversion efficiency reached 7.33%, and there was no significant decrease in efficiency during the cyclic test.
引用
收藏
页码:6815 / 6822
页数:8
相关论文
共 39 条
[1]   Thermoelectric Modules Based on Half-Heusler Materials Produced in Large Quantities [J].
Bartholome, Kilian ;
Balke, Benjamin ;
Zuckermann, Daniel ;
Koehne, Martin ;
Mueller, Michael ;
Tarantik, Karina ;
Koenig, Jan .
JOURNAL OF ELECTRONIC MATERIALS, 2014, 43 (06) :1775-1781
[2]   Dominant electron-phonon scattering mechanisms in n-type PbTe from first principles [J].
Cao, Jiang ;
Querales-Flores, Jose D. ;
Murphy, Aoife R. ;
Fahy, Stephen ;
Savic, Ivana .
PHYSICAL REVIEW B, 2018, 98 (20)
[3]   Recent progress of half-Heusler for moderate temperature thermoelectric applications [J].
Chen, Shuo ;
Ren, Zhifeng .
MATERIALS TODAY, 2013, 16 (10) :387-395
[4]   Enhancement of electrical performance via carrier modulation in single crystalline PbTe prepared by Pb-flux method [J].
Chen, Zhong ;
Tang, Yu ;
Li, Decong ;
Liu, Jianhong ;
Shen, Lanxian ;
Liu, Wenting ;
Sun, Luqi ;
Deng, Shukang .
JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 774 :282-289
[5]   Thermoelectric performance of half-Heusler compounds MYSb (M = Ni, Pd, Pt) [J].
Ding, Guangqian ;
Gao, G. Y. ;
Yao, K. L. .
JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2014, 47 (38)
[6]   Thermoelectric performance of multiphase XNiSn (X = Ti, Zr, Hf) half-Heusler alloys [J].
Downie, R. A. ;
MacLaren, D. A. ;
Bos, J. -W. G. .
JOURNAL OF MATERIALS CHEMISTRY A, 2014, 2 (17) :6107-6114
[7]   Are Solid Solutions Better in FeNbSb-Based Thermoelectrics? [J].
Fu, Chenguang ;
Liu, Yintu ;
Zhao, Xinbing ;
Zhu, Tiejun .
ADVANCED ELECTRONIC MATERIALS, 2016, 2 (12)
[8]   Realizing high figure of merit in heavy-band p-type half-Heusler thermoelectric materials [J].
Fu, Chenguang ;
Bai, Shengqiang ;
Liu, Yintu ;
Tang, Yunshan ;
Chen, Lidong ;
Zhao, Xinbing ;
Zhu, Tiejun .
NATURE COMMUNICATIONS, 2015, 6
[9]   Evidence for a quantum spin Hall phase in graphene decorated with Bi2Te3 nanoparticles [J].
Hatsuda, K. ;
Mine, H. ;
Nakamura, T. ;
Li, J. ;
Wu, R. ;
Katsumoto, S. ;
Haruyama, J. .
SCIENCE ADVANCES, 2018, 4 (11)
[10]   Tuning Multiscale Microstructures to Enhance Thermoelectric Performance of n-Type Bismuth-Telluride-Based Solid Solutions [J].
Hu, Lipeng ;
Wu, Haijun ;
Zhu, Tiejun ;
Fu, Chenguang ;
He, Jiaqing ;
Ying, Pingjun ;
Zhao, Xinbing .
ADVANCED ENERGY MATERIALS, 2015, 5 (17)