TAOS based Cu/TiW/IGZO/Ga2O3/Pt bilayer CBRAM for low-power display technology

被引:31
作者
Gan, Kai-Jhih [1 ,2 ]
Liu, Po-Tsun [3 ]
Chiu, Yu-Chuan [3 ]
Ruan, Dun-Bao [1 ,2 ]
Chien, Ta-Chun [3 ]
Sze, Simon M. [1 ,2 ]
机构
[1] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu 30010, Taiwan
[2] Natl Chiao Tung Univ, Inst Elect, Hsinchu 30010, Taiwan
[3] Natl Chiao Tung Univ, Dept Photon, Hsinchu 30010, Taiwan
关键词
Conductive-bridge random access memory (CBRAM); Indium-gallium-zinc-oxide; Gallium oxide; Thermal conductivity; Physical vapor deposition; THIN-FILM TRANSISTORS; HIGH-PERFORMANCE; MEMORY; OXIDE;
D O I
10.1016/j.surfcoat.2018.08.093
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
We demonstrate the characteristics of a conductive-bridging random access memory (CBRAM) with Cu/TiW/InGaZnO/Ga2O3/Pt stack structure. The addition of a thin metal-oxide layer (4.5 nm-thick Ga2O3) in the bottom of the CBRAM device significantly increases the off-state resistance (Rom') and the memory window. The IGZO bi-layer CBRAM shows the excellent memory performances, such as low operation current (down to 50 A), high on/off resistance ratio (> 10(3)), high switching endurance (up to 10(3) cycles) and the capability of multi-level tuning. Meanwhile, high thermal stability was also achieved. Three decades of resistance window is constantly maintained beyond 10(4)s at 85 degrees C. The resistive switching stability and electrical uniformity of bi-layer IGZO/Ga2O3 CBRAM device are obviously enhanced as compared with the one only with a single layer of IGZO film. These results have given a great potential for the transparent amorphous oxide semiconductor (TAOS)-based material utilizing in CBRAM stacks and integrating into the display circuits for future memory-in-pixel applications.
引用
收藏
页码:169 / 174
页数:6
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