共 16 条
- [1] Addressing packaging challenges - More focus on packaging research and technology development is required to handle shifting industry needs [J]. IEEE CIRCUITS & DEVICES, 2002, 18 (04): : 40 - 49
- [2] Babus'Haq R. F., 1990, Computer-Aided Engineering Journal, V7, P23, DOI 10.1049/cae.1990.0006
- [3] BELAID F, 1991, PESC 91 RECORD, P519, DOI 10.1109/PESC.1991.162724
- [4] BERGER R, 1984, P ANN REL MAINT S
- [5] BISCHAK G, 1998, WESCON 98, V1, P188
- [6] BLATTNER R, 2000, 1 SIL INC
- [7] CHANDRAN B, 1996, THERMAL PHENOMENA EL, P226
- [8] FLANNERY J, 2000, P 2000 INT POW PAACK, P3
- [9] HALLWOOD N, 1989, IEE C
- [10] JENSEN R, 1989, EL COMP C MAY, P572