Big bang, small bucks; Effective use of low-cost CAD packages

被引:0
|
作者
Pendse, R
Johnson, EL
机构
来源
FRONTIERS IN EDUCATION FIE'96 - 26TH ANNUAL CONFERENCE, PROCEEDINGS, VOLS 1-3: TECHNOLOGY-BASED RE-ENGINEERING ENGINEERING EDUCATION | 1996年
关键词
D O I
暂无
中图分类号
G40 [教育学];
学科分类号
040101 ; 120403 ;
摘要
At Wichita State University we have implemented an undergraduate three-course sequence in digital system design and computer architecture. Key to the success of these courses are two inexpensive yet very effective software packages called B2Logic [1] and Logic-Aid[2]. Both packages are very user friendly, requiring little practice to become proficient in their use. After the first two courses the students are familiar with both packages. By the end of the third course, Introduction to Computer Design, they will have developed a complete 4-bit processor using the B2Logic package. Using the simulation feature of the package they can load and run actual programs. As semester projects the students are required to add various features to the processor they have designed such as push-down stacks, branching instructions, etc.
引用
收藏
页码:510 / 513
页数:4
相关论文
共 50 条
  • [31] Low-cost and effective organic scintillators
    V. G. Vasil’chenko
    S. V. Golovkin
    A. M. Medvedkov
    A. S. Solov'ev
    Instruments and Experimental Techniques, 2000, 43 : 612 - 616
  • [32] Low-cost and effective organic scintillators
    Vasil'chenko, VG
    Golovkin, SV
    Medvedkov, AM
    Solov'ev, AS
    INSTRUMENTS AND EXPERIMENTAL TECHNIQUES, 2000, 43 (05) : 612 - 616
  • [33] EFFECTIVE LOW-COST SCAVENGING SYSTEM
    MEYERS, EF
    ANESTHESIOLOGY, 1980, 52 (03) : 277 - 277
  • [34] EFFECTIVE PLANETARY EXPLORATION AT LOW-COST
    MOORE, JW
    ASTRONAUTICS & AERONAUTICS, 1982, 20 (10): : 28 - &
  • [35] MAKING IT BIG IN CONFECTIONERIES - LOW-COST JARS
    不详
    FOOD ENGINEERING, 1983, 55 (06): : 61 - 61
  • [36] NEW APPROACHES TO LOW-COST ELECTRONIC-CIRCUIT PACKAGES
    BAXTER, E
    FOGLE, J
    IEEE TRANSACTIONS ON CONSUMER ELECTRONICS, 1983, 29 (01) : 10 - 17
  • [37] LOW-COST TO PACKAGES FOR HIGH-SPEED MICROWAVE APPLICATIONS
    LARSON, DA
    HECKAMAN, DE
    FRISCO, JA
    HASKINS, DA
    MICROWAVE JOURNAL, 1986, 29 (05) : 91 - 91
  • [38] Low-cost programmer interconnects to high-density packages
    Personal Engineering and Instrumentation News, 1995, 12 (12):
  • [39] Designing small footprint, low-cost, high-reliability packages for performance sensitive MEMS sensors
    Sarihan, Vijay
    Wen, Jian
    Li, Gary
    Koschmieder, Thomas
    Hooper, Ryan
    Shumway, Russell
    Macdonald, James
    58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, : 817 - 818
  • [40] A SYSTEM OF SOLID MODELING FOR LOW-COST CAD SYSTEMS
    KLIMOV, VE
    KLISHIN, VV
    NEDER, AV
    TERENTIEV, AS
    COMPUTERS & GRAPHICS, 1988, 12 (3-4) : 407 - 413