Lateral SCR devices with low-voltage high-current triggering characteristics for output ESD protection in submicron CMOS technology

被引:27
作者
Ker, MD [1 ]
机构
[1] Ind Technol Res Inst, Comp & Commun Res Labs, VLSI Design Div, Hsinchu 310, Taiwan
关键词
D O I
10.1109/16.662790
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A high-current PMOS-trigger lateral SCR (HIPTSCR) device and a high-current NMOS-trigger lateral SCR (HINTSCR) device with a lower trigger voltage but a higher trigger current are proposed to improve ESD robustness of CMOS output buffer in submicron CMOS technology, The lower trigger voltage is achieved by inserting a short-channel thin-oxide PMOS or NMOS devices into the lateral SCR structures, The higher trigger current is achieved by inserting the bypass diodes into the structures of the HIPTSCR and HINTSCR devices, These HIPTSCR and HINTSCR devices have a lower trigger voltage to effectively protect the output transistors in the ESD-stress conditions, but they also have a higher trigger current to avoid the unexpected triggering due to the electrical noise on the output pad when the CMOS IC's are in the normal operating conditions, Experimental results have verified that the trigger current of the proposed HIPTSCR (HINTSCR) is increased up to 225.5 mA (218.5 mA), But, the trigger voltage of the HIPTSCR (HINTSCR) is still remained at a lower value of 13.4 V (11.6 V), The noise margin against the overshooting (undershooting) voltage pulse on the output pad, without accidentally triggering on the HINTSCR (HIPTSCR), can be greater than VDD+12 V (VSS -12 V). These HIPTSCR and HINTSCR devices have been practically used to protect CMOS output buffers with a 4000-V (700-V) HEM (MM) ESD robustness but only within a small layout area of 37.6 x 60 mu m(2) in a standard 0.6-mu m CMOS technology without extra process modification.
引用
收藏
页码:849 / 860
页数:12
相关论文
共 29 条
[1]  
AMERASEKERA A, 1994 EOS ESD S P, V16, P237
[2]   A LOW-VOLTAGE TRIGGERING SCR FOR ON-CHIP ESD PROTECTION AT OUTPUT AND INPUT PADS [J].
CHATTERJEE, A ;
POLGREEN, T .
IEEE ELECTRON DEVICE LETTERS, 1991, 12 (01) :21-22
[3]  
CHATTERJEE A, 1990 P S VLSI TECHN, P75
[4]  
CHWASTEK E, 1989, P EOS ESD S, V11, P149
[5]  
CORP MB, 1990, ZAPPI TAMING ESD RFI
[6]  
DIAZ C, 1994 EOS ESD S P, V16, P106
[7]  
DUVURY JC, 1987, P IRPS, P174
[8]   ESD - A PERVASIVE RELIABILITY CONCERN FOR IC TECHNOLOGIES [J].
DUVVURY, C ;
AMERASEKERA, A .
PROCEEDINGS OF THE IEEE, 1993, 81 (05) :690-702
[9]  
Duvvury C., 1986, P IRPS, P199
[10]  
DUVVURY C, 1988, 1991 EOS ESD S P, V13