Various replication techniques for manufacturing three-dimensional metal microstructures

被引：65

作者：

Ruprecht, R ^{[1
]}

Benzler, T ^{[1
]}

Hanemann, T ^{[1
]}

Mulle, K ^{[1
]}

Konys, J ^{[1
]}

Piotter, V ^{[1
]}

Schanz, G ^{[1
]}

Schmidt, L ^{[1
]}

Thies, A ^{[1
]}

Wollmer, H ^{[1
]}

Hausselt, J ^{[1
]}

机构：

[1] Forschungszentrum Karlsruhe, Inst Mat Forsch 3, D-76021 Karlsruhe, Germany

来源：

MICROSYSTEM TECHNOLOGIES | 1997年 / 4卷 / 01期

关键词：

Silicon; Microstructure; Mold; Binary Alloy; Injection Molding;

D O I：

10.1007/s005420050087

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In microsystem technology a large range of different materials will be available only after the necessary micromanufacturing techniques have been developed or adapted. Existing manufacturing techniques are structuring or shaping techniques producing three-dimensional microstructures out of silicon (silicon etching, silicon surface micromechanics), mostly unfilled plastics (lithographic techniques, injection molding, hot embossing, reaction molding) or a few pure metals or binary alloys (electroforming). The choice of materials for microcomponents is determined by the function and conditions of use of microsystems. Especially the range of metals is still restricted considerably because the only processes available are electroforming and thin-layer techniques. It is for these reasons that we are developing various processes for manufacturing three-dimensional metal microstructures. In addition to direct electroforming of injection molding lost plastic micromolds, these are a new microcasting process and Micro Metal Injection Molding (Micro MIM). Microstructures have already been molded from mold inserts made by micromechanical cutting or by the LIGA technique. The results achieved, and future prospects, are outlined below.

引用

页码：28 / 31

页数：4