Efficient spice macromodel for EMI analysis of electronic packages and high-speed interconnects

被引：5

作者：

Shinh, G ^{[1
]}

Nakhla, N ^{[1
]}

Achar, R ^{[1
]}

Nakhla, M ^{[1
]}

Dounavis, A ^{[1
]}

Erdin, I ^{[1
]}

机构：

[1] Carleton Univ, Ottawa, ON K1S 5B6, Canada

来源：

ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2004年

关键词：

D O I：

10.1109/EPEP.2004.1407609

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a SPICE macromodel for fast transient analysis of lossy multiconductor transmission Me (MTL) Interconnects in the presence of electromagnetic Interference (EMI). A simplified formulation based on split representation at both ends of the MTL structure for computation of equivalent sources in the time-domain is described. A passive and compact macromodel based on delay extraction and closed-form representation is used to describe the distributed nature of the MTL stamp. The proposed algorithm, while guaranteeing the stability of the simulation by employing passive macromodels, provides significant speed-up for EMI analysis of transmission line networks, especially with large delay and low losses.

引用

页码：277 / 280

页数：4

共 7 条

[1]

Das R. K., 1996, P IEEE INT S EL COMP, P265

[2] Passive closed-form transmission-line model for general-purpose circuit simulators [J].